Lead Free Assemble Technology by Anisotropic Conductive Film.

Lead Free Conductive Composites for Electrical Interconnections

Characteristic study of anisotropic-conductive film for chip-on-film packaging

Mechanical Properties Measurement of Nanowires Anisotropic Conductive Film by Nanoindentation Technique

As microelectronic packaging industry grows explosively, high I/O density interconnects and reliable packaging design are recognized as the main concern of the IC packaging industry. Hence, in this investigation, a novel type of anisotropic conductive film (ACF) composed of cobalt nanowires and polymer was developed and used in place of conventional solder bumps for ultra-fine pitch interconnec...

Thermal Conductivity Performance Modeling and Characterization of a Novel Anisotropic Conductive Adhesive Used in Lead-free Electronics Packaging

The continued desire to utilize an alternative to leadbased solder materials for electrical interconnections has led to significant research interest in Anisotropic Conductive Adhesives (ACAs). The use of ACAs in electrical connections creates bonds using a combination of metal particles and epoxies to replace solder. The novel ACA discussed in this paper allows for bonds to be created through ...

Direct Printing of 1-D and 2-D Electronically Conductive Structures by Molten Lead-Free Solder

This study aims to determine the effects of appropriate experimental parameters on the thermophysical properties of molten micro droplets, Sn-3Ag-0.5Cu solder balls with an average droplet diameter of 50 μm were prepared. The inkjet printing parameters of the molten micro droplets, such as the dot spacing, stage velocity and sample temperature, were optimized in the 1D and 2D printing of metall...